3M has launched a new generation of cover tape that enables near-flawless placement of today’s shrinking chips on circuit boards without sticking, static charge, or contamination
Ever-shrinking electronic component sizes, driven by wafer-level chip scale packaging, demand that circuit board manufacturers deliver performance, speed and reliability in these advanced and ultra-small packages.3M has launched a new generation of cover tape that enables near-flawless placement of today's shrinking chips on circuit boards without sticking, #
Combined with longer reels, 3M’s Pressure-Sensitive Cover Tape 2698, helps to eliminate pick-and-place errors, minimize down-time and increase productivity – all at no greater cost than other tape.
Wafer-level chip scale packages and other electronic components are embedded into circuit boards at high-speed using a stamping machine that picks up components from reels of carrier tape and stamps them onto each board. The thinner, lighter nature of thee packages can lead to unit stick. As components continue to become smaller, only the highest quality tape can ensure accurate feeding, picking, and placement, according to a press release.
3M Pressure-Sensitive Cover Tape 2698 is a transparent, polyester film tape with synthetic, room-temperature, pressure-sensitive adhesive zones at its sides. It is available in standard widths and 600 metre long reels designed to reduce changeover time and enable productivity improvements. It will work in existing industry-standard equipment.
The cover tape offers excellent abrasion resistance with virtually no drop-outs and gives stable peel force, light transmission, and surface resistivity performance.
3M provides a wide array of innovative products and systems that enable greater speed, brightness, and flexibility in today’s electronic devices, while addressing industry needs for increased thinness, sustainability, and longevity. (GK)
Fibre2fashion News Desk - India
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