Lear Corporation, one of the world’s leading suppliers of automotive seating and electrical systems, has appointed Mei-Wei Cheng to Lear’s board of directors. Cheng currently serves as the non-executive chairman of the board of directors of HCP Packaging and is a member of the board of directors of both Interplex Holdings Pte Ltd and NIU Technologies.

Cheng previously served as the non-executive chairman of the board of directors of Pactera, a Blackstone portfolio company, as well as a director and senior advisor to several other manufacturing and technology companies, said a press release from Lear Corporation. From 2010 to 2014, Cheng was CEO of Siemens North East Asia and president and CEO of Siemens Ltd, China. Prior to joining Siemens, Cheng spent more than a decade at Ford Motor (China) Ltd as chairman and CEO. In addition, he has served as chairman and CEO of GE (China) Ltd and president of AT&T China.

Cheng holds a bachelor’s degree in industrial engineering/operations research from Cornell University, an MBA from Rutgers University, and is a graduate of Dartmouth’s Tuck executive programme and MIT’s programme for senior executives.

“We are pleased to welcome Mei-Wei to Lear’s board of directors,” said Henry DG Wallace, Lear’s non-executive chairman. “Mei-Wei’s deep knowledge of the Chinese market, strong leadership, and executive experience will be instrumental in helping guide our growth and strategy, particularly in China.” (PC)